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Lift-off Equipment - List of Manufacturers, Suppliers, Companies and Products

Lift-off Equipment Product List

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Lift-off device *Models available for testing

We customize the equipment by selecting each process and specification from the lineup of single-sided and batch types.

Dalton's lift-off devices come in six models and offer six types of options, allowing you to select the appropriate one based on your application and the characteristics of the wafer. 【Models】 - HU Type (for mass production)… A combination of batch and single wafer specifications. Faster and more reliable finishing. - HM Type (for research and development/mass production)… Suitable for wafers that can be stripped using only jet processing. - CHU Type (for research and development)… Inherits the features of the HU type while achieving compactness. - MJ Type (for research and development)… Contains only a jet chamber, with manual operation for wafer loading and unloading. - SL Type (for mass production)… A shower drain type lift-off device that performs lift-off processing using only a dip tank. - ML Type (for research and development/mass production)… A device that removes the loader, conveyor, and unloader from the SL type. You can add five types of options to the above six models. For details on the options, please scroll down and take a look. Testing can be conducted at our Tokyo Test Center. *For more information, please download the catalog or feel free to contact us.

  • Resist Device
  • Lift-off Equipment

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New Type SpinDip Processor: Lift-off, Organic Stripping, Deburring

Practical application of ultrasonic ultrasonic technology mounted on a spin sheet device!

■Rich track record in lift-off and organic peeling processes ■Capable of building systems with wide process margins according to various substrate conditions ■Simultaneous mounting of various peeling/lift-off tools possible Tool selection and combined use possible based on substrate conditions (type/process, etc.) ◎<BLT-type ultrasonic><Horn-type ultrasonic><High-pressure jet><Chemical two-fluid><Multi-spray> ■Equipped with <BLT-type ultrasonic> for low-damage, general-purpose substrate ultrasonic processing ◎BLT-type ultrasonic: Frequency = 38KHz, Vibration amplitude = less than 1μ (P-P) ■Capable of mounting ultra-high amplitude <Horn-type ultrasonic> suitable for robust resist peeling/lift-off ◎Horn-type ultrasonic: Frequency = 38KHz, Vibration amplitude = Max 20μ (P-P) ■Conducting highly uniform ultrasonic processing ◎Standing wave irregularities... theoretically impossible (ultrasonic processing with only direct waves) ◎Irregularities within the ultrasonic vibration surface... strong/weak irregularities above the element (strong) and between elements (weak) are resolved by <substrate rotation> and ultrasonic <scan optimization> ■Application development for burr removal and cleaning after polishing has been implemented *For more details, please refer to the PDF document or feel free to contact us.

  • Semiconductor inspection/test equipment
  • Lift-off Equipment

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